Application Areas
It can be applied to internal defect detection in semiconductor, chip package detection, composite new materials, diamond composite sheet, aerospace materials, low-voltage electrical appliances, new energy lithium battery, carbon fiber materials and other fields.

Testing process
Longitudinal/transverse wave detection
A-scan, B-scan, C-scan, transmission scan, multilayer scan, Tray-pallet scan, etc.

Testing Standards
Comply with the relevant automation field application standards, national standards, international standards
Mechanical structure form
Can be customized according to client's requirements
System Software Advantages
◆ Full information recording waveform, 1:1 accurate reproduction of the shape of the inspected workpiece and the size of defects
◆ With zoom-in/zoom-out function, it can clearly show the state of defect edges.
◆Water layer straightening function, eliminating the water layer error generated by walking back and forth.
◆B and D scan can easily view the cross section of any XY axis
◆With custom color level function
Technical specification
Scanning step Minimum 7um
Bandwidth 1MHz~100MHz
Gain Adjustment Range 0db~110db
Step value 0.2, 0.5, 1.0, 2.0, 6.0dB, 12.0dB with high and low pass filter function
Resistance 50Ω, 500Ω
Transmitted pulses Square wave (voltage 50V to 250V, pulse width 10ns to 250ns)
Detection mode RF, full wave, positive half wave, negative half wave
Sampling Rate 100MHz~5GHz (multi-speed adjustable)
Sampling depth 512-4096
Pulse Repetition Frequency 20Hz to 27,500Hz, automatically adjustable
Technical Advantages
1, Wide bandwidth, can be adapted to a variety of medium and high-frequency ultrasonic application scenarios;
2, The highest 5GHz sampling frequency, sampling frequency adjustable, real restore the original waveform;
3, The system has A (point scanning), B (longitudinal scanning), C (transverse scanning), transmission scanning (need to configure the transmission scanning unit and receiving probe options), multi-layer scanning, Tray-pallet scanning function;
4, With wave amplitude, transit time, phase and FFT mode imaging function. Can realize the workpiece thickness measurement and ranging, defect size marking function, can count the defect size and area, automatically calculate the defect area ratio;
5, Waveform trigger mode: wave-peak, leading edge, over zero point;
6, With image coloring function, according to the phase flip automatic coloring; according to the gray level of manual coloring; according to the thickness change, automatic coloring.
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