Detection process
Probe stepping comb scanning to detect the bonding situation of honeycomb panel between the horizontal layer and vertical layer
Detection standard
None
The form of mechanical structure
Gantry walking type
System software(function description, interface display)
1. Full information record the waveform of each pixel, which is convenient for troubleshooting in the analysis software
2. The defect area is identified automatically after the detection.
3. Automatically adjust the amplitude of bottom wave, calibrate the bottom wave to the same horizontal line through compensation.
4. Automatically calibrate the chip quality
5. In the process of automatic testing, the system will automatically generate an audible and visual alarm when it detects defects or delamination and poor coupling in thickness measurement.
Technical advantages
→Special imaging algorithm to ensure the imaging of complex internal structure’s workpiece
→Unique area evaluation function, which can effectively screen defective products
→The system uses16/128 multi-channel phased array instruments, with 128 linear array high-resolution self-focusing probes, which can easily identify the internal ribs of the workpiece.
→Fast detection speed, flexible focusing, intuitive and easy-to-understand imaging method, especially suitable for the evaluation of defects of internal special-shaped materials.
→Workpiece automatic flip function, more scientific detection.
Technical Specifications
5000mm（length）×3000mm（width）×50mm（thickness: the thickness of the aluminum alloy plate is 3mm）
Imaging Accuracy：max1mm/p
None
