HS 810 is a TOFD inspection instrument developed based on the ultrasonic time of flight diffraction method.
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HS 810 is a TOFD inspection instrument developed based on the ultrasonic time of flight diffraction method. It is currently the main instrument for obtaining certification (the TOFD II level personnel qualification training and assessment model for special industries in China). It can support 3 pairs of TOFD flaw detection channels and can be configured with 3 pairs of TOFD probes ( Extensible), it supports one-time full-coverage scanning of workpieces with a thickness of 12mm-200mm. The detection rate of defects in the middle of flat or butt welds is very high, it is easy to detect defects with poor directionality, and defects extending to the surface can be identified.
→ Integrate A-scan, B-scan imaging, TOFD imaging, guided wave imaging in one device.
→ Unique Synthetic Aperture Focusing (SAFT) technology
→ Built-in on-site inspection process model, automatically generate inspection process
→ Portable scanners and automatic scanning devices replace manual scanning to meet the inspection requirements of various workpieces
→ A-scan: RF display improves the ability of the instrument to evaluate defect modes in materials
→ B-scan imaging: real time display of defect section shape
→ TOFD scanning image: real-time display of gray scanning image of defects, visual display of defects and evaluation of defect quality
→ Multi-channel TOFD inspection and PE inspection fully cover the area scanning within 200mm thickness, which can be expanded to 400mm thickness.
→ Straight-through wave removal: special processing tool for near-surface defects to improve the accuracy of near-surface defect analysis
→ Horizontal and vertical adjustment: meet different field operation habits
SAFT: Internationally recognized function to effectively improve the accuracy of defect measurement
→ Instrument software: equiped with SAFT function, Lateral wave Straighten and Removal function
→ Off-line analysis software: equipped with SAFT (Synthetic Aperture Focus) processing function, equipped with the same screen contrast display function before and after image processing, which also equipped with the function of directly converting TOFD images into BMP bitmaps
→ Offline record analysis: recovery and playback of A-scan waveform recorded during scanning; Statistical analysis of defect size and height/ depth / amplitude data; Record conversion to ASCII / msword / MS Excel format report
Transmit parameters
Pulse pattern | Negative square wave pulse |
Pulse leading edge | <10 ns |
Pulse width | 40ns-1000ns Continuous adjustable (8ns increment) |
Impedance matching | 25Ω、500Ω |
Probes can be connected at the same time | 10 |
Receiving parameters
Sampling frequency / bits | 125MHZ/12bits |
Sampling depth | 512/1024 adjustable |
Repetition frequency | 100Hz-800Hz adjustable |
Attenuator accuracy | <1dB/12dB |
Equivalent input noise | <60nV/√Hz |
Scan range | Zero interface incident -14000mm steel longitudinal wave |
Sound speed velocity | (300-20000) m/s |
Dynamic Range | ≥30dB |
Vertical linearity error | ≤3% |
Horizontal linearity error | ≤0.3% |
Comprehensive performance
Resolution | >30dB |
Surplus sensitivity | >52dB (Φ2×200mm) |
Detection mode | Full wave, Negative or Positive half wave, RF wave |
Waveform averaging | 1-8 adjustable |
Imaging mode | A-scan, B-scan, C-scan |
Linear scanning length | (0 - 40000) mm Auto-scroll |
Instrument parameters
Instrument size | 248×180×80 (mm) |
Instrument weight | 2.4kg (including battery) |
Screen size | 6.5" |
Display resolution | 640×480 |
Man-machine interactive | keyboard, shuttle mode |
Power supply / battery | DC (DC12V/2A) Battery: 11.1V/6600mAH |
Solid state drives | 8 GB |
Interface | LAN, USB2.0, VGA |
Ambient temperature | (-10-40)°C (reference value) |
Relation humidity | (20 - 95) %RH |
Delivery inspection | Provide European standard inspection report |
Application
Boilers, pressure vessels, pipelines and various butt welds
Solutions
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